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MCP1701A
2 A Low-Dropout Positive Voltage Regulator
Features
* 2.0 A Typical Quiescent Current * Input Operating Voltage Range up to 10.0V * Low-Dropout Voltage (LDO): - 120 mV (typ) @ 100 mA - 380 mV (typ) @ 200 mA * High Output Current: 250 mA (VOUT = 5.0V) * High-Accuracy Output Voltage: 2% (max) * Low Temperature Drift: 100 ppm/C (typ.) * Excellent Line Regulation: 0.2%/V (typ.) * Package Options: 3-Pin SOT-23A, 3-Pin SOT-89, and 3-Pin TO-92 * Short Circuit Protection * Standard Output Voltage Options: - 1.8V, 2.5V, 3.0V, 3.3V, 5.0V
General Description
The MCP1701A is a family of CMOS low-dropout, positive voltage regulators that can deliver up to 250 mA of current while consuming only 2.0 A of quiescent current (typ.). The input operating range is specified up to 10V, making it ideal for lithium-ion (one or two cells), 9V alkaline and other two and three primary cell battery-powered applications. The MCP1701A is capable of delivering 250 mA with an input-to-output voltage differential (dropout voltage) of 650 mV. The low-dropout voltage extends the battery operating lifetime. It also permits high currents in small packages when operated with minimum VIN - VOUT differentials. The MCP1701A offers improved startup and transient response. The MCP1701A has a tight tolerance output voltage regulation of 0.5% (typ.) and very good line regulation at 0.2%. The LDO output is stable when using only 1 F of output capacitance of either tantalum or aluminum-electrolytic style capacitors. The MCP1701A LDO also incorporates short circuit protection to ensure maximum reliability. Package options include the 3-pin SOT-23A, 3-pin SOT-89 and 3-Pin TO-92.
Applications
* * * * * * * * * * * * Battery-Powered Devices Battery-Powered Alarm Circuits Smoke Detectors CO2 Detectors Smart Battery Packs PDAs Low-Quiescent Current Voltage Reference Cameras and Portable Video Equipment Pagers and Cellular Phones Solar-Powered Instruments Consumer Products Microcontroller Power
Package Types
3-Pin SOT-23A VIN 3 MCP1701A 1 GND 2 VOUT MCP1701A 1 2 3 GND VIN VOUT 3-Pin TO-92 123 3-Pin SOT-89 VIN
Bottom View GND VIN VOUT Note: 3-Pin SOT-23A is equivalent to the EIAJ SC-59.
(c) 2006 Microchip Technology Inc.
Preliminary
DS21990A-page 1
MCP1701A
Functional Block Diagram
MCP1701A
VIN VOUT
Short-Circuit Protection + Voltage Reference GND
Typical Application Circuits
MCP1701A
GND VOUT 3.3V IOUT 50 mA VIN VOUT COUT 1 F Tantalum VIN 9V Alkaline Battery CIN 1 F Tantalum
DS21990A-page 2
Preliminary
-
(c) 2006 Microchip Technology Inc.
MCP1701A
1.0 ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
Input Voltage ........................................................ +12V Output Current (Continuous)..........PD/(VIN - VOUT)mA Output Current (peak) ..................................... 500 mA Output Voltage ............... (GND - 0.3V) to (VIN + 0.3V) Continuous Power Dissipation: 3-Pin SOT-23A ............................................ 150 mW 3-Pin SOT-89............................................... 500 mW 3-Pin TO-92 ................................................. 300 mW
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits are established for an ambient temperature of TA = +25C.
Parameters
Output Voltage Regulation Maximum Output Current
Sym
VOUT IOUTMAX
Min
VR - 2% 250 200 150 150 125 110
Typ
VR0.5% -- -- -- -- -- -- 0.8 1.1 1.3 1.5 1.8 0.8 380 400 400 400 400 180 2.0 0.2 -- 100 200
Max
VR + 2% -- -- -- -- -- -- +1.60 +2.25 +2.72 +3.00 +3.60 +1.60 600 630 700 700 700 300 4.5 0.3 10 -- --
Units V
mA VOUT = 5.0V VOUT = 4.0V VOUT = 3.3V VOUT = 3.0V VOUT = 2.5V VOUT = 1.8V %
Conditions
IOUT = 40 mA (Note 1) (VIN = VR + 1.0V)
Load Regulation (Note 3)
VOUT/ VOUT
-1.60 -2.25 -2.72 -3.00 -3.60 -1.60
VOUT = 5.0V, 1 mA IOUT 100 mA VOUT = 4.0V, 1 mA IOUT 100 mA VOUT = 3.3V, 1 mA IOUT 80 mA VOUT = 3.0V, 1 mA IOUT 80 mA VOUT = 2.5V, 1 mA IOUT 60 mA VOUT = 1.8V, 1 mA IOUT 30 mA
Dropout Voltage
VIN - VOUT
-- -- -- -- -- --
mV
IOUT = 200 mA, VR = 5.0V IOUT = 200 mA, VR = 4.0V IOUT = 160 mA, VR = 3.3V IOUT = 160 mA, VR = 3.0V IOUT = 120 mA, VR = 2.5V IOUT = 20 mA, VR = 1.8V
Input Quiescent Current Line Regulation Input Voltage Temperature Coefficient of Output Voltage Output Rise Time
IQ VOUT*100 VIN*VOUT VIN TCVOUT TR
-- -- -- -- --
A %/V V ppm/ C sec
VIN = VR + 1.0V IOUT = 40 mA, (VR +1) VIN 10.0V
IOUT = 40 mA, -40C TA +85C (Note 2) 10% VR to 90% VR, VIN = 0V to VR +1V, RL = 25 resistive
1: 2: 3:
VR is the nominal regulator output voltage. For example: VR = 1.8V, 2.5V, 3.3V, 4.0V, 5.0V. The input voltage VIN = VR + 1.0V, IOUT = 40 mA. TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * Temperature), VOUT-HIGH = Highest voltage measured over the temperature range. VOUT-LOW = Lowest voltage measured over the temperature range. Load regulation is measured at a constant junction temperature using low duty cycle pulse testing.
(c) 2006 Microchip Technology Inc.
Preliminary
DS21990A-page 3
MCP1701A
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, TA = +25C. Parameters Temperature Ranges Specified Temperature Range (I) Storage Temperature Range Package Thermal Resistances Thermal Resistance, 3L-SOT-23A JA -- -- Thermal Resistance, 3L-SOT-89 Thermal Resistance, 3L-TO-92 JA JA -- -- 335 230 52 131.9 -- -- -- -- C/W C/W C/W C/W Minimum trace width single layer application Typical FR4, 4-layer application Typical, when mounted on 1 square inch of copper EIA/JEDEC JESD51-751-7 4-layer board TA TA -40 -40 -- -- +85 +125 C C Sym Min Typ Max Units Conditions
DS21990A-page 4
Preliminary
(c) 2006 Microchip Technology Inc.
MCP1701A
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Notes: Unless otherwise specified, VOUT = 1.8V, 3.0V, 5.0V, TA = +25C, CIN = 1 F Tantalum, COUT = 1 F Tantalum.
1.40 1.35
Supply Current (A)
VR = 1.8V +85C
1.30 1.25 1.20 1.15 1.10 1.05 1.00 0.95 2
Supply Current (A)
+25C
0C
-40C
3
4
5
6
7
8
9
10
1.70 1.68 1.66 1.64 1.62 1.60 1.58 1.56 1.54 1.52 1.50 1.48 1.46 1.44 0
VIN = 4.0V VR=3.0V +25C
0C
+85C
-40C
20
40
Input Voltage (V)
60 80 100 120 140 160 180 200 Load Current (mA)
FIGURE 2-1: Supply Current vs. Input Voltage (VR = 1.8V).
1.90 1.85 Supply Current (A) 1.80 1.75 1.70 1.65 1.60 1.55 1.50 3 4 5 6 7 8 Input Voltage (V) 9 10
40C 0C +85C +25C VR = 3.0V
FIGURE 2-4: Supply Current vs. Load Current (VR = 3.0V).
1.80
VIN = 6.0V VR = 5.0V +25C +85C 0C
Supply Current (A)
1.75 1.70 1.65 1.60 1.55 1.50 1.45 0 20 40
-40C
60 80 100 120 140 160 180 200 Load Current (mA)
FIGURE 2-2: Supply Current vs. Input Voltage (VR = 3.0V).
1.96
FIGURE 2-5: Supply Current vs. Load Current (VR = 5.0V).
2.4
VIN = VR + 1V IOUT = 0 A VR = 5.0V VR = 3.0V
Supply Current (A)
Supply Current (A)
1.92 1.88 1.84 1.80 1.76 1.72 1.68 1.64 5 6 7 8 Input Voltage (V) 9
-40C 0C +85C +25C
VR = 5.0V
2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8
VR = 1.8V
10
-40 -25 -10
5
20 35 50 65 80 95 110 125 Temperature (C)
FIGURE 2-3: Supply Current vs. Input Voltage (VR = 5.0V).
FIGURE 2-6: Temperature.
Supply Current vs.
(c) 2006 Microchip Technology Inc.
Preliminary
DS21990A-page 5
MCP1701A
Note: Unless otherwise indicated, VOUT = 1.8V, 3.0V, 5.0V, TA = +25C, CIN = 1 F Tantalum, COUT = 1 F Tantalum.
1.85 1.84
IOUT = 0.1 mA
1.810
Output Voltage (V)
VIN = 2.8V +85C
Output Voltage (V)
1.83 1.82 1.81 1.80 1.79 1.78 2
+25C +85C 0C
1.805 1.800
-40C
0C +25C
1.795 1.790
-40C
3
4
5 6 7 Input Voltage (V)
8
9
10
0
20
40
60
80
Load Current (mA)
FIGURE 2-7: Output Voltage vs. Input Voltage (VR = 1.8V).
3.05 3.04
IOUT = 0.1mA
FIGURE 2-10: Output Voltage vs. Load Current (VR = 1.8V).
3.02
Output Voltage (V)
+85C +25C
VIN = 4.0V
Output Voltage (V)
3.03 3.02 3.01 3.00 2.99 2.98 2.97 4 5
+25C +85C 0C
3.00
0C
2.98
-40C
-40C
2.96
9 10
6 7 8 Input Voltage (V)
0
20
40
60
80
100
120
140
Load Current (mA)
FIGURE 2-8: Output Voltage vs. Input Voltage (VR = 3.0V).
5.04 5.03
IOUT = 0.1mA +25C
FIGURE 2-11: Output Voltage vs. Load Current (VR = 3.0V).
5.04
Output Voltage (V)
VIN = 6.0V
Output Voltage (V)
5.02 5.01 5.00 4.99 4.98 4.97 4.96 5.5
5.02 5.00
+25C
+85C
0C -40C
+85C
0C
4.98 4.96 4.94
0 20 40 60
-40C
80
100
120
140
160
180
200
220
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5 10.0
Input Voltage (V)
Load Current (mA)
FIGURE 2-9: Output Voltage vs. Input Voltage (VR = 5.0V).
FIGURE 2-12: Output Voltage vs. Load Current (VR = 5.0V).
DS21990A-page 6
Preliminary
(c) 2006 Microchip Technology Inc.
240
MCP1701A
Note: Unless otherwise indicated, VOUT = 1.8V, 3.0V, 5.0V, TA = +25C, CIN = 1 F Tantalum, COUT = 1 F Tantalum.
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0
VR = 1.8V
Dropout Voltage (V)
+25C
+85C
-40C
0C
15
30
45
60
75
90
Load Current (mA)
FIGURE 2-13: Dropout Voltage vs. Load Current (VR = 1.8V).
0
FIGURE 2-16: (VR = 1.8V).
Start-up From VIN
0.8 0.7
VR = 3.0V
Dropout Voltage (V)
0.6 0.5 0.4 0.3 0.2 0.1 0 0 20 40 60 80 100
-40C +25C
+85C
0C
120
140
Load Current (mA)
FIGURE 2-14: Dropout Voltage vs. Load Current (VR = 3.0V).
0.7
VR = 5.0V +25C
FIGURE 2-17: (VR = 3.0V).
Start-up From VIN
Dropout Voltage (V)
0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 50 100
-40C +85C
0C
150
200
250
Load Current (mA)
FIGURE 2-15: Dropout Voltage vs. Load Current (VR = 5.0V).
FIGURE 2-18: (VR = 5.0V).
Start-up From VIN
(c) 2006 Microchip Technology Inc.
Preliminary
DS21990A-page 7
MCP1701A
Note: Unless otherwise indicated, VOUT = 1.8V, 3.0V, 5.0V, TA = +25C, CIN = 1 F Tantalum, COUT = 1 F Tantalum.
0.00
Load Regulation (%)
VR = 1.8V IOUT = 1 to 30 mA
0.15
Line Regulation (%/V)
-0.05 -0.10 -0.15 -0.20 -0.25 -0.30 -0.35 -0.40
0 -40 -30 -20 -10 10 20 30 40
VIN = 2.8V VIN = 6.0V
0.14 0.13 0.12 0.11 0.10
IOUT = 1 mA IOUT = 90 mA
VR = 1.8V VIN = 2.8V to 10V
VIN = 4.0V
IOUT = 40 mA
IOUT = 10 mA
50
60
70
80
90
-40
-30
-20
-10
0
10
20
30
40
50
60
70 70 70
80 80 80
Temperature (C)
Temperature (C)
FIGURE 2-19: Load Regulation vs. Temperature (VR = 1.8V).
-0.30
VR = 3.0V IOUT = 1 to 80 mA
FIGURE 2-22: Line Regulation vs. Temperature (VR = 1.8V).
0.13
Line Regulation (%/V)
Load Regulation (%)
-0.35 -0.40 -0.45 -0.50 -0.55 -0.60 -0.65 -0.70
VIN = 10.0V VIN = 6.0V
0.12 0.11 0.10 0.09 0.08 0.07 0.06
VR = 3.0V VIN = 4.0V to 10V
IOUT = 1 mA
IOUT = 10 mA
VIN = 4.0V
IOUT = 150 mA
0
-40
-30
-20
-10
10
20
30
40
50
60
70
80
90
-40
-30
-20
-10
0
10
20
30
40
50
60
Temperature (C)
Temperature (C)
FIGURE 2-20: Load Regulation vs. Temperature (VR = 3.0V).
0.0
VR = 5.0V IOUT = 1 to 100 mA
FIGURE 2-23: Line Regulation vs. Temperature (VR = 3.0V).
0.17
VR = 5.0V VIN = 6.0V to 10V IOUT = 1 mA IOUT = 10 mA
Line Regulation (%/V)
Load Regulation (%)
-0.1 -0.2 -0.3 -0.4 -0.5 -0.6
VIN = 10.0V VIN = 7.0V
0.16 0.15 0.14 0.13 0.12 0.11 0.10 0.09 0.08
VIN = 6.0V
IOUT = 100 mA IOUT = 250 mA
0
-40
-30
-20
-10
10
20
30
40
50
60
70
80
90
-40
-30
-20
-10
0
10
20
30
40
50
60
Temperature (C)
Temperature (C)
FIGURE 2-21: Load Regulation vs. Temperature (VR = 5.0V).
FIGURE 2-24: Line Regulation vs. Temperature (VR = 5.0V).
DS21990A-page 8
Preliminary
(c) 2006 Microchip Technology Inc.
90
90
90
MCP1701A
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin No. SOT-23A 1 2 3
PIN FUNCTION TABLE
Pin No. SOT-89 1 3 2 Pin No. TO-92 1 3 2 Name GND VOUT VIN Ground Terminal Regulated Voltage Output Unregulated Supply Input Function
3.1
Ground Terminal (GND)
3.3
Unregulated Supply Input (VIN)
Regulator ground. Tie GND to the negative side of the output and the negative side of the input capacitor. Only the LDO bias current (2 A, typ.) flows out of this pin, there is no high current. The LDO output regulation is referenced to this pin. Minimize voltage drops between this pin and the negative side of the load.
3.2
Regulated Voltage Output (VOUT)
Connect VOUT to the positive side of the load and the positive terminal of the output capacitor. The positive side of the output capacitor should be physically located as close as possible to the LDO VOUT pin. The current flowing out of this pin is equal to the DC load current.
Connect the input supply voltage and the positive side of the input capacitor to VIN. Like all low-dropout linear regulators, low source impedance is necessary for the stable operation of the LDO. The amount of capacitance required to ensure low source impedance will depend on the proximity of the input source capacitors or battery type. The input capacitor should be physically located as close as possible to the VIN pin. For most applications, 1 F of capacitance will ensure stable operation of the LDO circuit. For applications that have load currents below 100 mA, the input capacitance requirement can be lowered. The type of capacitor used can be ceramic, tantalum or aluminum electrolytic. The low equivalent series resistence characteristics of the ceramic will yield better noise and PSRR performance at high frequency. The current flow into this pin is equal to the DC load current, plus the LDO bias current (2 A, typ.).
(c) 2006 Microchip Technology Inc.
Preliminary
DS21990A-page 9
MCP1701A
4.0 DETAILED DESCRIPTION
4.2 Input Capacitor
The MCP1701A is a low-quiescent current, precision, fixed-output voltage LDO. Unlike bipolar regulators, the MCP1701A supply current does not increase proportionally with load current. A 1 F input capacitor is recommended for most applications when the input impedance is on the order of 10. Larger input capacitance may be required for stability when operating from a battery input, or if there is a large distance from the input source to the LDO. When large values of output capacitance are used, the input capacitance should be increased to prevent high source impedance oscillations.
4.1
Output Capacitor
A minimum of 1 F output capacitor is required. The output capacitor should have an ESR greater than 0.1 and less than 5, plus a resonant frequency above 1 MHz. Larger output capacitors can be used to improve supply noise rejection and transient response. Care should be taken when increasing COUT to ensure that the input impedance is not high enough to cause high input impedance oscillation.
4.3
Overcurrent
The MCP1701 internal circuitry monitors the amount of current flowing through the P-channel pass transistor. In the event of a short circuit or excessive output current, the MCP1701 will act to limit the output current.
VIN
VOUT
Short Circuit Protection + Voltage Reference GND
FIGURE 4-1:
MCP1701A Block Diagram.
DS21990A-page 10
Preliminary
-
(c) 2006 Microchip Technology Inc.
MCP1701A
5.0
5.1
THERMAL CONSIDERATIONS
Power Dissipation
The amount of power dissipated internal to the LDO linear regulator is the sum of the power dissipation within the linear pass device (P-channel MOSFET) and the quiescent current required to bias the internal reference and error amplifier. The internal linear pass device power dissipation is calculated as shown in Equation 5-1.
To determine the junction temperature of the device, the thermal resistance from junction-to-ambient must be known. The 3-pin SOT-23 thermal resistance from junction-to-air (RJA) is estimated to be approximately 335 C/W. The SOT-89 RJA is estimated to be approximately 52 C/W when mounted on 1 square inch of copper. The RJA will vary with physical layout, airflow and other application-specific conditions. The device junction temperature is determined by calculating the junction temperature rise above ambient, then adding the rise to the ambient temperature.
EQUATION 5-1:
PD (Pass Device) = (VIN - VOUT) x IOUT The internal power dissipation, as a result of the bias current for the LDO internal reference and error amplifier, is calculated as shown in Equation 5-2.
EQUATION 5-5:
JUNCTION TEMPERATURE - SOT-23 EXAMPLE:
EQUATION 5-2:
PD (Bias) = VIN x IGND The total internal power dissipation is the sum of PD (pass device) and PD (bias).
T J = PDMAX x R JA + T A T J = 116.0 milliwatts x 335C/W + 55C T J = 93.9C
EQUATION 5-6:
JUNCTION TEMPERATURE - SOT-89 EXAMPLE:
EQUATION 5-3:
PTOTAL = PD (Pass Device) + PD (Bias) For the MCP1701A, the internal quiescent bias current is so low (2 A, typ.) that the PD (bias) term of the power dissipation equation can be ignored. The maximum power dissipation can be estimated by using the maximum input voltage and the minimum output voltage to obtain a maximum voltage differential between input and output. The next step would be to multiply the maximum voltage differential by the maximum output current.
T J = 116.0 milliwatts x 52C/W + 55C T J = 61C
EQUATION 5-4:
PD = (VINMAX - VOUTMIN) x IOUTMAX Given: VIN VOUT IOUT TAMAX PMAX PMAX = = = = = = 3.3V to 4.1V 3.0V 2% 1 mA to 100 mA 55C (4.1V - (3.0V x 0.98)) x 100 mA 116.0 milliwatts
(c) 2006 Microchip Technology Inc.
Preliminary
DS21990A-page 11
MCP1701A
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
3-Pin SOT-23A 3-Pin SOT-89 3-Pin TO-92
2 1 2 3 4 1
4
3
1234 5678 9 10 11 12
1
represents first voltage digit 1V, 2V, 3V, 4V, 5V, 6V Ex: 3.xV =
3
1, 2, 3 & 4 5
= 701A (fixed)
represents first voltage digit (1-6) represents first voltage decimal (0-9) represents extra feature code: fixed: 0 represents regulation accuracy 2 = 2.0% (standard) represents assembly lot number
2
represents first decimal place voltage (x.0 - x.9) Ex: 3.4V = Symbol A B C D E
3 E
6
Voltage x.0 x.1 x.2 x.3 x.4
Symbol F H K L M
Voltage x.5 x.6 x.7 x.8 x.9
7
8
9 , 10, 11 & 12
3
represents polarity 0 = Positive (fixed) represents assembly lot number
4
DS21990A-page 12
Preliminary
(c) 2006 Microchip Technology Inc.
MCP1701A
3-Lead Plastic Small Outline Transistor (CB) (SOT23)
E E1
2
B n p
p1
D
1
c
A
A2
L
Units Dimension Limits Number of Pins Pitch Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width * Controlling Parameter Notes: n p p1 A A2 A1 E E1 D L c B .035 .035 .000 .098 .055 .106 .014 0 .004 .012 - - - - - - - - - MIN INCHES NOM
A1 MILLIMETERS* MAX 3 .037 BSC .075 BSC .055 .051 .006 .118 .071 .122 .022 10 .014 .019 0.90 0.90 0.00 2.50 1.40 2.70 0.35 0 0.10 0.30 0.95 BSC 1.90 BSC - - - - - - - - - - 1.40 1.30 0.15 3.00 1.80 3.10 0.55 10 0.35 0.50 MIN NOM 3 MAX
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. BSC: Basic Dimension. Theoretically exact value shown without tolerances. See ASME Y14.5M EIAJ Equivalent: SC-59 Drawing No. C04-130 Revised 09-14-05
(c) 2006 Microchip Technology Inc.
Preliminary
DS21990A-page 13
MCP1701A
3-Lead Plastic Small Outline Transistor (MB) (SOT89)
H E B1
3 B D D1 2 R 1 L E1 B1 p p1
A
C Units Dimension Limits Pitch Outside Lead Pitch Overall Height Overall Width Molded Package Width at Base Molded Package Width at Top Overall Length Tab Length Tab Corner Radii Foot Length Lead Thickness Lead 2 Width Leads 1 & 3 Width * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. BSC: Basic Dimension. Theoretically exact value shown without tolerances. See ASME Y14.5M JEDEC Equivalent: TO-243 Drawing No. C04-029 Revised 09-19-03 p p1 A H E E1 D D1 R L c B B1 MIN .059 BSC .118 BSC .055 .155 .090 .084 .173 .064 .010 .035 .014 .017 .014 .047 .019 .022 .019 .063 .167 .102 .090 .181 .072 INCHES MAX MILLIMETERS* MIN 1.50 BSC 3.00 BSC 1.40 3.94 2.29 2.13 4.40 1.62 0.254 0.89 0.35 0.43 0.36 1.20 0.48 0.56 0.48 1.60 4.25 2.60 2.29 4.60 1.83 MAX
DS21990A-page 14
Preliminary
(c) 2006 Microchip Technology Inc.
MCP1701A
3-Lead Plastic Transistor Outline (TO) (TO-92)
E1
D
1
n
L
1
2
3
B p c
A
R Units Dimension Limits n p INCHES* NOM 3 .050 .130 .143 .175 .186 .170 .183 .085 .090 .500 .555 .014 .017 .016 .019 4 5 2 3
MILLIMETERS NOM 3 1.27 3.30 3.62 4.45 4.71 4.32 4.64 2.16 2.29 12.70 14.10 0.36 0.43 0.41 0.48 4 5 2 3
MIN
MAX
MIN
MAX
Number of Pins Pitch Bottom to Package Flat A .155 Overall Width E1 .195 Overall Length D .195 Molded Package Radius R .095 Tip to Seating Plane L .610 c Lead Thickness .020 Lead Width B .022 6 Mold Draft Angle Top Mold Draft Angle Bottom 4 * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: TO-92 Drawing No. C04-101
3.94 4.95 4.95 2.41 15.49 0.51 0.56 6 4
(c) 2006 Microchip Technology Inc.
Preliminary
DS21990A-page 15
MCP1701A
NOTES:
DS21990A-page 16
Preliminary
(c) 2006 Microchip Technology Inc.
MCP1701A
APPENDIX A: REVISION HISTORY
Revision A (February 2006)
* Original Release of this Document.
(c) 2006 Microchip Technology Inc.
Preliminary
DS21990A-page 17
MCP1701A
NOTES:
DS21990A-page 18
Preliminary
(c) 2006 Microchip Technology Inc.
MCP1701A
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device XXX X X X/ XX Examples:
a) MCP1701AT-1802I/CB: 1.8V LDO Positive Voltage Regulator, SOT-23A-3 pkg. MCP1701AT-1802I/MB: 1.8V LDO Positive Voltage Regulator, SOT89-3 pkg. MCP1701AT-2502I/CB: 2.5V LDO Positive Voltage Regulator, SOT-23A-3 pkg. MCP1701AT-3002I/CB: 3.0V LDO Positive Voltage Regulator, SOT-23A-3 pkg. MCP1701AT-3002I/MB: 3.0V LDO Positive Voltage Regulator, SOT89-3 pkg. MCP1701AT-3302I/CB: 3.3V LDO Positive Voltage Regulator, SOT-23A-3 pkg. MCP1701AT-3302I/MB: 3.3V LDO Positive Voltage Regulator, SOT89-3 pkg. MCP1701AT-5002I/CB: 5.0V LDO Positive Voltage Regulator, SOT-23A-3 pkg. MCP1701AT-5002I/MB: 5.0V LDO Positive Voltage Regulator, SOT89-3 pkg.
Tape Output Feature Tolerance Temp. Package and Reel Voltage Code
b)
Device: Tape and Reel: Output Voltage: MCP1701A: 2 A Low-Dropout Positive Voltage Regulator
c)
T = Tape and Reel
18 = 1.8V "Standard" 25 = 2.5V "Standard" 30 = 3.0V "Standard" 33 = 3.3V "Standard" 50 = 5.0V "Standard" *Contact factory for other output voltage options. 0 2 I = Fixed = 2.0% (Standard) = -40C to +85C
d)
e)
Extra Feature Code: Tolerance: Temperature: Package Type:
f)
g)
h)
CB = 3-Pin SOT-23A (equivalent to EIAJ SC-59) MB = 3-Pin SOT-89 TO = 3-Pin TO-92
i)
(c) 2006 Microchip Technology Inc.
Preliminary
DS21990A-page 19
MCP1701A
NOTES:
DS21990A-page 20
Preliminary
(c) 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, Real ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and Zena are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2006 Microchip Technology Inc.
Preliminary
DS21990A-page 21
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Alpharetta, GA Tel: 770-640-0034 Fax: 770-640-0307 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 San Jose Mountain View, CA Tel: 650-215-1444 Fax: 650-961-0286 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
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ASIA/PACIFIC
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EUROPE
Austria - Wels Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
02/16/06
DS21990A-page 22
Preliminary
(c) 2006 Microchip Technology Inc.

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